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Each year, a panel of 30 senior computer architects chooses 10 of the
year’s most significant research publications for publication in a special
issue of IEEE Micro. For the 3rd Year in a row, a paper from UCSB Computer
Science is present: Introspective 3D Chips by Shashi Mysore, Banit
Agrawal, and Sheng-Chih Lin, Navin Srivastava, Kaustav Banerjee, and
Timothy Sherwood from ASPLOS 2006. To deal with the complexity of modern
systems, software developers are increasingly dependent on specialized
development tools such as security profilers, memory leak identifiers,
data flight recorders, and dynamic type analysis. In their paper, the
authors argue that a new way to attack this problem is with the addition
of specialized analysis hardware, literally stacked on top of the
processor die using 3D-integration technology. This provides a modular
“snap-on” functionality that could be included with developer systems,
while keeping the cost impact on consumer systems to minimum. More
information can be found here