Memory systems are often the largest dollar cost as well as the largest consumer of energy in the datacenter. Moreover, many of the problems we see in the memory system are cross-disciplinary in nature and their solution would likely require work at all levels, from applications to circuits. In their recent award winning paper in MEMSYS, recent UCSB Computer Science graduates Heba Saadeldeen and Zhaoxia (Summer) Deng, along with Professor Tim Sherwood and Univ. Chicago Professor Fred Chong show that even the collection of materials such memories are built from is an important aspect of design to consider. "Thermal-aware, heterogeneous materials for improved energy and reliability in 3D PCM architectures" shows, for the first time, that rather than a “one-memory-fits-all” approach a heterogeneous 3D phase-change memory (PCM) architecture is possible. By tailoring the material (Ge-Sb-Te) ratios of PCM in concert with both the location and the intended function of these memories within the 3D stack such heterogeneous PCM architectures improve the programming energy by up to 3.5X compared to the best homogeneous configuration. The paper was selected for the MEMSYS 2017 Best Paper Award by the program chair which was graciously accepted by Summer after her presentation. Congratulations to Heba, Summer, Tim, and Fred.